AML ANNOUNCES ITS MOST SIGNIFICANT DEAL IN THE COMPANY’S HISTORY
Aligned Wafer Bonder Enables Mobile Phone Manufacturers to realise exciting new function
Applied Microengineering Ltd (AML), innovative suppliers of wafer bonding machines and bonding services, has announced that its in-situ Aligned Wafer Bonding (AWB) machines are today firmly at the leading edge of global product innovation, with 2009 sales successes with a market leading mobile phone component manufacturer, commercial organisations and renowned academic institutions.
The most significant AWB sale in AML’s history has been placed by a market-leading organisation in Taiwan, to deliver high-volume production wafer level packaging technology utilised by the global mobile phone market. “The company previously tried a machine from one of our competitors, but it was failing to meet the stringent specifications and throughput that were required,” explains CEO of AML, Rob Santilli. “We demonstrated that our AWB’s could combine the highest levels of alignment accuracy and high throughput, 8” wafer level, adhesive bonding for this high-volume production requirement, so crucial to this market. The new function provided by this technology is mind blowing and everyone with a mobile phone will want it! ”
Today, we have a unique capability in this area and an advantage others cannot compete with in the large and growing market application of high accuracy, adhesive bonding, with both thermal and the first ever aligned, UV cure option system planned for this July, with even faster throughput.”
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AML Press Release
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