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Applied Microengineering Ltd (AML), world leaders in wafer bonding machines and bonding services, has announced the launch of its multi-million pound BONDCENTRE and new advanced bonded substrate business. The state-of-the-art facility, now complete, is situated on the UK’s premiere science park in Harwell, Oxfordshire.
AML LAUNCHES MULTI-MILLION POUND BONDCENTRE
The world’s only State-Of-The-Art Commercial Wafer Bonding Service
launches new advanced bonded substrate business
Applied Microengineering Ltd (AML), world leaders in wafer bonding machines and bonding services, has announced the launch of its multi-million pound BONDCENTRE and new advanced bonded substrate business. The state-of-the-art facility, now complete, is situated on the UK’s premiere science park in Harwell, Oxfordshire.
The new BONDCENTRE, a UK centre of excellence, enables AML to make its 20 years experience in wafer bonding available to start-up’s, large corporate and government R&D labs, manufacturing businesses and academic institutions. It delivers these national and international organisations the ability to speed up technology, process and product development, as well as providing a smooth transfer of technology to volume production for improved time to market.
CEO of AML, Rob Santilli explains: “BONDCENTRE services are increasingly in demand for innovative new market applications, including MEMS, microelectronics, life sciences, optics, compound semiconductors, wafer level packaging, 3D integration and advanced bonded substrates.”
Equipped with AML’s unique Aligned Wafer Bonder machines and staffed by the UK’s most talented experts in commercial wafer bonding techniques, the BONDCENTRE is currently the only commercial facility in the world to provide wafer bonding and associated services for 2", 3", 4", 6" and 8" wafers, in a class 10 clean room environment. Outsourcing to BONDCENTRE makes economic sense, reducing timescales and negating investment in equipment, facilities and know-how.
Completing the launch of the BONDCENTRE is AML’s new advanced bonded substrate business initially available for substrates including Silicon-Glass, Silicon<100>-Silicon<111> and Silicon-Quartz. Wafers can be pre-machined (holes and channels) and supplied with conducting via arrays before bonding, for use in wafer level packaging and 3D integration.
Santilli adds: “A core strength of the BONDCENTRE is the ability not only to offer bonding but also related services such as powder blasting, screen printing, CMP, electroplating metrology and inspection all under one roof. In the past, our customers may have had wafers CMP’d in the USA, drilled in Japan, screen printed with glass frit in Germany and bonded in the UK. At BONDCENTRE we can do this all in one location ensuring their product innovations can be brought to market faster.”
About the AML BONDCENTRE
AML’s new BONDCENTRE offers a wealth of new services including:
· Wafer bonding process development e.g. for many novel materials such as silicon, glass, sapphire, strained silicon, InP, GaAs etc
· Wafer bonding process selection & design for customer bespoke applications
· Commercial wafer bonding service from prototype to production
· Wafer bonding technology transfer (including equipment) and training
The BONDCENTRE also offers a range of associated pre and post bond services including:
· Wafer cleaning and activation
· Wafer Metrology e.g. profiling, surface roughness & TTV
· Wafer structuring: e.g. channels, holes and conducting vias via powder blasting
· Wafer Deposition: PVD, electroplating (Au, In, Ni, Cu) Screen print; Glass frit & Adhesive
· Wafer preparation: - CMP planarisation & surface finish
· Inspection of bonded assemblies - SAM and IR
About AML
Applied Microengineering Ltd (AML) is an independent private company established in 1992.
The company manufactures unique in-situ aligned wafer bonding machines and provides services based around wafer bonding in its new state-of-the-art multi-million pound BONDCENTRE facility situated on the UK’s premiere science park in Harwell, Oxfordshire.
AML’s comprehensive BONDCENTRE provides services from the development of bonding processes to a commercial bonding service – one off to volume. Associated services include CMP, powder blasting, electroplating, screen-printing and metrology - a ‘One Stop’ wafer bonding service.
The company’s unique Aligned Wafer Bonder machines, the only machines capable of in-situ alignment, activation and bonding on the market, are particularly suited to the bonding requirements of MEMS, IC, & III-V industries for bonded substrates, device fabrication, 3D integration and wafer level packaging. An upgrade allows micro-nano polymer embossing & imprinting. The machines have the flexibility for R&D and the throughput and automation for volume production as well as the lowest cost of ownership and first class support.
AML’s machines and services are sold worldwide via agents and distributors in China, Hong Kong, USA, India, Israel, Europe, Canada, Japan, Korea, Taiwan, Singapore and Australia.
For further information, please visit www.aml.co.uk
Editorial Contacts
Graham Thatcher/Fiona Brewer/Alex Kenchington
MCC International
T: 01962 888 100
F: 01962 888 125
E: nanopr@mccint.com
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